HealthSportsTANAKA Breakthrough: New Bonding Technology for Dense Semiconductor Mounting with AuRoFUSE(TM) Preforms

TANAKA Breakthrough: New Bonding Technology for Dense Semiconductor Mounting with AuRoFUSE(TM) Preforms

TANAKA Introduces Innovative Bonding Technology for High-Density Semiconductor Mounting with AuRoFUSE(TM) Preforms

Revolutionizing the optical and digital technology sector with advanced solutions for achieving smaller and denser semiconductor mounting

TOKYO – March 11, 2024 – TANAKA Kikinzoku Kogyo K.K. has recently unveiled a groundbreaking gold particle bonding technology designed specifically for high-density semiconductor mounting. This technology utilizes AuRoFUSE™ low-temperature fired paste, a cutting-edge material that facilitates gold-to-gold bonding with remarkable precision and efficiency.

AuRoFUSE™ consists of submicron-sized gold particles combined with a specialized solvent to create a bonding material that offers low electrical resistance and superior thermal conductivity. By leveraging AuRoFUSE™ preforms (in dried paste form), this innovative technology enables the achievement of 4 μm fine-pitch mounting with 20 μm bumps. Through a thermocompression bonding process conducted at 200°C and 20 MPa pressure for 10 seconds, AuRoFUSE™ preforms exhibit approximately 10% compression in the compressive direction while maintaining minimal deformation horizontally. This unique combination results in exceptional bonding strength, making them ideal for use as gold bumps. Additionally, with gold being the primary component known for its high chemical stability, AuRoFUSE™ preforms offer unmatched reliability post-mounting.

The introduction of this technology marks a significant breakthrough in the field of semiconductor manufacturing, allowing for the miniaturization of wiring and enhanced integration for various chip applications. With the potential to drive technical innovation in advanced technologies such as LEDs, LDs, personal computers, smartphones, and automotive components, this technology is poised to shape the future of digital devices.

To further promote the adoption of this cutting-edge solution, TANAKA plans to distribute samples of the technology widely in the marketplace. The company will also showcase this groundbreaking technology at the upcoming 38th Spring Conference of the Japan Institute of Electronics Packaging, scheduled from March 13 to 15, 2024, at the prestigious Tokyo University of Science.

Enhancing High-Density Mounting Capabilities with AuRoFUSE™ Preforms

Traditionally, semiconductor devices have been mounted using various bonding methods, including solder and plating techniques. While solder-based bonding offers cost-effective and rapid bump production, concerns arise regarding the risk of short-circuiting through electrode contact as bump pitches become finer due to solder spreading during the melting process. In the quest for high-density mounting solutions, innovative approaches like the use of AuRoFUSE™ preforms have emerged as game-changers in the semiconductor industry.

By incorporating advanced bonding techniques, TANAKA is at the forefront of technological advancements, driving progress in the semiconductor sector and beyond.

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